WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax

WL high-accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX 11,11Pro,11 Pro Max,12,12Pro,12 Pro Max NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High-Quality Soldering BGA Reballing Stencil With Fixed Plate.

Specifications:
Material: High-end Imported Steel Mesh
Color: As Picture Shows
Type: High Precision Ball Planting Net
Model Number: WL High Quality Tin Plant Net Kits
Design: High-Precision Hole Automatic Location
Suit for: for iPhone 6 7 8 Baseband Soldering Repair
Application: for for iPhone NAND Baseband Soldering Repair
Usage: BGA Rework Tool
Compacity: for iPhone 5S 6 6S 7 8 X XS MAX NAND
Function:for iPhone Baseband NAND Repair
DIY Type: CPU BGA reballing

Features:
High-end imported specially made ball planting steel mesh, 100% original WL BGA stencil.
Special Design: High-Precision hole automatic location, easy to use.
High-accuracy BGA Reballing template for iPhone motherboard repairing.
With Black Positioning Mold, more accurate CPU IC welding position.
Super compacity: for Multi-model iPhone 5S 6 6S 7 8 X XS MAX NAND Baseband repair.
Aluminum mould base: It is universal, which fit with any black positioning mold, (Choose different package ), just 1pcs Aluminum mold base, easy for your working, as well as save money.
WL high quality BGA Reballing Stencils kit come with black positioning mold

Option:
Option 1:for iPhone 5/5s Baseband and NAND
Option 2: for iPhone 6/6p Baseband and NAND
Option 3: for iPhone 6s/6sp Baseband and NAND
Option 4: for iPhone 7 7P Baseband NAND
Option 5: for iPhone 8/8p/X Baseband NAND
Option 6: for iPhone XS MAX XR Baseband NAND
Option 7: for iPhone 11,11Pro,11 Pro Max Baseband NAND
Option 8: for iPhone 12,12mini,12 Pro Max Baseband NAND

Package includes :
1* WL BGA Reballing Stencil Template