MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini
Original price was: $24.00.$19.20Current price is: $19.20.
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MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
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