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BGA Reballing Stencil Kit Set For Samsung HUAWEI Xiaomi OPPO Meizu LG

Original price was: $5.59.Current price is: $4.47.

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SKU: BH44049055408 Category:

Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template.

Features:
–High Quality Stainless Steel BGA Reballing Stencil.
–Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
–Make your repair work easier.
–Color : Silver
–Feature : Square Hole
–We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

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