MaAnt Halogen-Free SMT Solder Paste Flux With Alloy Tube Welding Tool

MaAnt UP-78A Halogen-free SMT soldering flux, MY-223 flux paste with welding oil repair assistant toolkit. MaAnt UP-559 No-clean soldering paste flux grease. MaAnt MY-228 BGA Solder Paste High Viscosity Strong Activity No-clean 20ml White Flux. UGAIN UG-78 Lead-free halogen-free solder flux 10CC For Phone LED BGA SMD PGA PCB soldering repair.

10cc solder paste with aluminum alloy tube push rod + needle for electronic IC PCB Phone motherboard and small components/circuit board BGA SMD PGA PCB welding repair tool.

Note:Solder paste flux can only be sent out by special post mail.

UP-78A:

1. 100% new brand and high quality.
2. Good immersion and high intensity joints.
3. Easy to peel off with hands or tweezers, leaving no residue.
4. Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
5. Prevent contamination during assembly.
6. High soaking high strength joints.
7. No-toxic, no-corrosive, strong ability of insulation.
8. Good insulation and smooth welding surface. Nodeterioration no dry.
9. Suitable for welding mobile phone chips under high temperature operation.
10. Solve high rework, black screen of death, unstable performance. Chip soldering problems such as false soldering, virtual soldering, and automatic restart.

UP-559:

1. NO-Clean, lead-free, environmental soldering paste flux.
2. No residue, no corrosion, prevent metal oxidation good tin.
3. Great soldering paste for smartphone, PCB, BGA, SMD rework.
4. High-precision circuit board soldering SMT, BGA soldering processes, etc.
5. Good solderability, insulation resistance, no spattering and non-corrosive.
6. Widely used in adapted to the mobile phone repair industry, computer digital service industries.

Parameters

• Brand: MAANT
• Name: solder paste
• Model number: UP-559
• Paste: Halogen-free white paste
• Capacity: 10g
• Gross weight with shell: 19g
• Size: 95mm x 30mm

Specifications:

• Volume: 10ml/10cc
• Dimension: 93 x 33 x 23mm
• Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
• Color: Yellow
• Insulated: Yes
• With Needle Tip: Yes
• Application: for soldering and reballing of computer and phone chips.
• Advantage: Good immersion and high intensity joint.
• Function: for PCB, BGA, PGA reworking.
• 100%: New Type, high quality.