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BGA134 BGA200 BGA60 BGA168 BGA178 BGA136 BGA Stencil IC

Original price was: $4.00.Current price is: $3.20.

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SKU: BH44049055432 Category:

Reballing Stencil Template BGA134/BGA200/BGA/BGA60/BGA168/BGA178/BGA136 for iPhone CPU motherboard soldering repair.

Features:

1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.

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