Sale!

BGA Reballing Stencil Kit Set For Samsung HUAWEI Xiaomi OPPO Meizu LG

Original price was: $5.59.Current price is: $4.47.

Option:
  • Check Mark Satisfaction Guaranteed
  • Check Mark Easy Returns
  • Check Mark Secure Payments
  • Check Mark Exclusive Deals
GUARANTEED SAFE CHECKOUT
  • Visa Card
  • MasterCard
  • American Express
  • PayPal
  • Visa Card
SKU: BH44049055408 Category:

Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template.

Features:
–High Quality Stainless Steel BGA Reballing Stencil.
–Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
–Make your repair work easier.
–Color : Silver
–Feature : Square Hole
–We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

Reviews

There are no reviews yet.

Be the first to review “BGA Reballing Stencil Kit Set For Samsung HUAWEI Xiaomi OPPO Meizu LG”

Your email address will not be published. Required fields are marked *

Related products