$95.00Original price was: $95.00.$47.50Current price is: $47.50.
MaAnt 0.12mm Magnetic Reballing Platform Set for iPhone 6 to 14Pro Max A8 to A16 CPU BGA Repair Reballing Kit Maintenance Platform Planting Tin Net Suit Chip Repair Tools. Features:1. MaAnt0.12mm reballing platform for iPhone 6G/6 Plus/6S/6S Plus/7G/7 Plus/8G/8 Plus/X/XS/XS MAX/11/11Pro/11 PRO Max/12/12 Pro/12 mini/12 PRO MAX/13/13MINI/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max.2. Precision…
$2.99Original price was: $2.99.$2.39Current price is: $2.39.
MaAnt Comprehensive BGA Reballing Stencil for iPhone 6-16 Pro Max motherboard CPU NAND IC Tin Planting Soldering Repair. MaAnt 0.12mm square hole steel mesh reballing stencil for iPhone 6-16 Pro Max A8-A18 Pro CPU Nand WIFI and other chips. Features: The strong steel is not easy to deform at high temperature. Square hole fillet design,…
$4.05Original price was: $4.05.$3.24Current price is: $3.24.
MaAnt 0.12mm Universal Screen IC / Face / Tail Board / Infrared / True Tone Color / Camera BGA Reballing Stencil for iPhone 6-15 Pro Max Repair. Mechanic UFO Stencil Reballing for iPhone Face ID, Tail port board, Camera. Features: Keep the flexibility of steel for a long time, normal deformation and bending, and easy…
$3.99Original price was: $3.99.$3.19Current price is: $3.19.
MaAnt WiFi / Baseband / CPU / NFC Comprehensive BGA Reballing Stencil for iPhone 7 -14 Pro Max Repair. The stencil is made of high-quality materials and durable in use.Well-designed heat dissipation holes, very good heat dissipation, not easy to bulge, high success rate of tin planting. Solve the trouble when computer maintenance engineers use…
$39.55Original price was: $39.55.$31.64Current price is: $31.64.
AMAOE Mbga-B1 10 in 1 middle layer tin planting stencil platform for iPhone X-12 Pro Max. 10 in 1 Amaoe Mbga-B1 middle frame reballing platform for iPhone X/XS/XS MAX/11/11 Pro/11 Pro Max/12/12 mini/12 Pro/12 Pro Max repair. AMAOE 10 in 1 Mbga-B1 middle frame stencil with positioning plate and base for iPhone X-12 Pro Max…
$24.00Original price was: $24.00.$19.20Current price is: $19.20.
MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini. Features:1. Anti-leakage tin barrier design.2. High temperature does not allow the drum.3. Strong magnetic automatic…
$23.99Original price was: $23.99.$19.19Current price is: $19.19.
MECHANIC IBGA 13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X-13 Pro Max Mini,Mechanic Middle Layer Tin Planting Platform iBGA13 MAX for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Tin planting steel mesh positioning plate. MECHANIC iBGA13 MAX Middle Layer Positioning…
$22.99Original price was: $22.99.$18.39Current price is: $18.39.
Mechanic Mag Tin chip tin planting platform for iPhone Android. Mechanicmagnetic levitation chip tin planting platform with stencil for iPhone Huawei Qualcomm IC CPU Nand flash fonts reballing soldering.MECHANIC Mag Tin positioning Tin Planting reballing steel mesh for iPhone Android Phone Chip iPhone series/ Huawei series/ Qualcomm series. Option:1. Standard set: MagTin positioning platform +…
$39.99Original price was: $39.99.$31.99Current price is: $31.99.
MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone 6-16 Pro Max A8-A16 A17 A18 Pro CPU, Android Phones. MJ Z21 MAX CPU IC tin planting platform with stell mesh for iPhone Android CPU repair. MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15…
$2.99Original price was: $2.99.$2.39Current price is: $2.39.
QIANLI BGA reballing stencil for MacBook motherboard IC welding repair. Qianli MAC chip tin planting template for MacBook A1534, MacBook Pro A1706 A1707 A2159 IC SSD Nand Flash T2 RAM WIFI repair. Option:1. QS91: for 2015 MacBook A1534 SR23G CPU 820-00045-A.2. QS92: for MAC SSD.3. QS93: for MAC-SSD/DDR.4. QS94: for 2016 MacBook A1534 SR2ZY/EN/EM CPU…
$7.00Original price was: $7.00.$5.60Current price is: $5.60.
RELIFE RL-044 Precision BGA Stencils For iPhone 7-13 Series Motherboard repair, 0.12MM Stencils Rapid Heat Dissipation Suitable for iP7IP13 CPU/ Baseband/ WI-FI/ NFC/ BGA. Features:1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns. 2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive…
$17.99Original price was: $17.99.$14.39Current price is: $14.39.
RELIFE RL-044 Precision BGA Reballing Stencil CPU Chip Integrated Steel Mesh For iPhone 6-15 Pro Max, Huawei, Samsung Xiaomi and Android CPU series (SMC Qualcomm Snapdragon series, MTC Dimensity series, HIC hisilicon Kirin series, EMMC BGA series, ACU Android series). RELIFE RL-044 Integrated Tin Planting Steel Stencil For iPhone Huawei Samsung Xiaomi Android CPU RAM…
$19.00Original price was: $19.00.$15.20Current price is: $15.20.
RELIFE RL-601MA 9 in 1 Universal CPU Reballing Stencil Platform iPhone CPU Lower Layer Tin Planting Platform Set For A8-A16 iPhone 6~14 Pro Max IC Chip Planting Tin Template Fixture, Universal CPU Reballing Stencil Platform RL-601MA for iPhone 6 to 14Pro Max A8/A9/A10/A12/A13/A14/A15/A16 IC Chip Planting Tin Template Fix. Features: iPhone CPU tin planting platform…
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