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AMAOE BGA Reballing Stencil Positioning Plate For iPhone 12 series A14 CPU Tin Planting Glue Removing Repair. 0.12mm Amaoe A14 CPU reballing stencil steel mesh positioning plate metal base set for iPhone 12 / 12 Pro / 12 Pro Max / 12 Mini soldering repair. Options:0.12mm A14 lower stencil(half covered version)0.12mm A14 lower stencil(uncovered version)0.12mm…
0.12mm AMAOE CPU BGA Reballing Stencil Platform for A15 CPU iPhone 13/13 Mini/13 Pro/13 Pro Max repair. Amaoe A15 CPU BGA reballing stencil with positioning plate and metal base for iPhone 13 series CPU soldering repair. Amaoe A15 CPU BGA Reballing Stencil iPhone 13 mini/13/13 Pro/13 Pro Max CPU upper lower layer tin planting steel…
Amaoe CPU Reballing Platform with stencil for iPhone A6-17 Pro CPU RAM chips soldering repair. Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad for mobile phone BGA CPU chips reballing soldering repair. Amaoe PD-A reballing platform for Phone BGA CPU chips reballing glue removal repair. Amaoe CPU reballing platform with magnet base positioning…
AMAOE BGA Reballing Stencil Plant Tin Platform Set for SamsungS20 Ultra G988U/G988B/S10 G977 /Note10 N970U 9700/Note10 N976V 975F,Amao Middle-layer tin planting station/S20 Ultra G988U/G988B/S10 G977 /Note10 N970U 9700/Note10 N976V 975F Motherboard Middle-layer steel mesh S20 Ultra G988U/G988B suit Package List:1 x No.4+No.6 blade1 x s20 G988U 0.12MM stencil1 x s20 G988B/BR 0.12MM stencil1 x s20…
Amaoe iCloud removal BGA reballing stencil platform for iPhone 7-17 Pro Max NAND Flash/CPU/Baseband EEPROM IC tin planting. Amaoe Mbga-IP 26 in 1 BGA reballing platform for iPhone 7-15 Pro Max. Amaoe Mbga-IP iPhone BGA tin planting/glue removal stencil with platform. Amaoe CNC Board Swap Reballing Platform Kit: 1x Amaoe Magnetic Base.1x Amaoe positioning plate…
Amaoe Mbga-B12 8 in 1 CPU Reballing Stencil Tin Planting Glue Removing Positioning Plate kit for iPhone A8 to A14. Amaoe Mbga U1 U2 U3 U4 U31 U32 steel mesh with Mbga-B12 Positioning Plate Mbga/MFix-UBase base For A8 A9 A10 A11 A12 A13 A14 A15 CPU repair. 8 In 1 Amaoe Mbga-B12 A8-A15 CPU Reballing…
Amaoe middle layer reballing platform for iPhone X-16 Pro Max motherboard soldering repair. Amaoe iPhone X/11/12/13/14/15/16 series 28-in-1 motherboard middle frame tin planting station with stencil steel mesh set. Amaoe Motherboard Mid-Frame BGA Reballing Stencil Platform ForiPhone X/XS/XR/XSMax/11/11Pro/11 ProMax/12/12mini/12Pro/12 Pro Max /13/13 Pro/13 Pro Max/13 mini/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16…
Kaisi 18 In 1 Magnetic Silicone Middle Frame Tin Planting BGA Reballing Platform with Stencils for iPhone X-14 Pro Max Motherboard Middle Layer Soldering Repair. Features: Themagnetic platform that allows you to easily and quickly swap out BGA stencils, and ensure unmovable reballing work. It comes with multiple middle-layer reballing platforms and applies to a…
MiJing M21 universal magnetic base mobile phone motherboard middle layer frame reballing platform. MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid frame BGA Tin planting repair. Mijing GX01 GX02 Non-magnetic tin paste scraper knife set for motherboard IC…
Qianli 10 In 1 Magnetic 3D Middle Frame Reballing Platform For iPhone X-12 Pro MAX Motherboard Middle Frame Reballing Stencil. Features:1. Support for iPhone X/XS/XSMax/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini.2. Material : High hardness synthetic stone. Steel.3. Precision Positioning; Double sided use.4. Strong Magnetic Attraction.5. Product Size:106*60*10mm. Package:1x 10 in 1 BGA Reballing…
QianLi motherboard middle frame reballing platform with BGA stencil for iPhone X-16 Pro Max. Qianli iPhone middle layer reballing fixture for iPhone X/11/12/13/14/15/16 Pro Max motherboard repair. Qianli iPhone X-16 series middle frame tinning station with BGA stencil for iPhone motherboard layering and bonding. Features:1. QianLi middle frame reballing platform for iPhone X/XS/XS MAX/11/11Pro/11 PRO…
WL high-accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX 11,11Pro,11 Pro Max,12,12Pro,12 Pro Max NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High-Quality Soldering BGA Reballing Stencil With Fixed Plate. Specifications:Material: High-end Imported Steel MeshColor: As Picture ShowsType:…
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8-A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic…
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